Power chips are connected to external circuits through packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are normally packaged as power components. Chip affiliation refers to the electric connection on the top surface of the chip, which is generally light weight aluminum bonding wire in typical components. ^
Typical power module plan cross-section
At present, business silicon carbide power components still mostly use the product packaging technology of this wire-bonded traditional silicon IGBT module. They deal with issues such as huge high-frequency parasitic specifications, inadequate warmth dissipation ability, low-temperature resistance, and insufficient insulation strength, which limit making use of silicon carbide semiconductors. The screen of outstanding performance. In order to solve these issues and totally exploit the massive potential advantages of silicon carbide chips, lots of brand-new product packaging technologies and options for silicon carbide power modules have emerged recently.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold cables to copper cords, and the driving pressure is cost reduction; high-power tools have actually developed from aluminum cords (strips) to Cu Clips, and the driving force is to enhance item efficiency. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging approaches, Cu Clip technology has the following benefits:
1. The connection between the chip and the pins is made of copper sheets, which, to a specific degree, changes the basic wire bonding method between the chip and the pins. Consequently, a special plan resistance value, greater existing flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can totally save the cost of silver plating and poor silver plating.
3. The product appearance is completely regular with typical items and is primarily made use of in web servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is a lot more expensive and complex, but it can accomplish much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad uses a Clip technique, and the Gate makes use of a Wire method. This bonding method is somewhat cheaper than the all-copper bonding technique, saving wafer area (applicable to really little gate locations). The procedure is less complex than the all-copper bonding approach and can acquire better Rdson and far better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper dollar, please feel free to contact us and send an inquiry.
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